개요

Die를 Pick up하여 Substrate에 접합하는 설비

 

특징

High Productivity and Excellent Accuracy

- Placement Accuracy : ±6㎛ @ SRM - UPEH : Max 7,000
- High Performance Vision Installation (Substrate/ Die / Wafer/ Under vision)
- Inspection : Crack / Particle / Align miss
- MCP Stack Package ( 16 Chip Stack ↑)
- Thin Die Handling System : Thin Die 25 ㎛ & Eject Time : 0.3Sec

Various Handling Capability

- Wafer Bin Grade Work Capability & 異種 Package Product / Two Rail
- Full Auto Device Change & Material Automation System
- Wafer/ MGZ/ 異種 PCB & Mixed Handling System