개요

300mm Wafer의 Post CMP Clean, PR Strip, Ashingless PR Strip, Metal 제거 공정애 대응 가능한 매엽식 세정설비

특징

Process Performance

- High Temperature SPM Process over 150℃
- PR Strip, Post CMP Clean, Metal Clean and etc.

Productivity / Hardware

- Contamination Free Clean by NIC Bowl
- H2SO4 Recycle System
- Energy Efficiency Rating : Class 1