개요

Sorting된 Chip을 고속으로 Leadframe에 접착시키는 장비입니다.

 

특징

Thin die handling without any die crack

- Using specialized patent air ejector
- Handling 25↑㎛ die thickness

High productivity and excellent accuracy

- 2-step bonding for thin & large size die
- Placement accuracy : ±15㎛@3σ (with under vision)
- 4M vision installation (substrate, under vision)
- High accurate dispenser unit