System Engineering Mega Solution
System Engineering Mega Solution
Description
Overview
Line automation system for transferring various wafer packages with high cleanliness and high speed
Feature
- Transferring wafer packages with optimal path between manufacturing processes/equipments by OCS(OHT Control System)
- Transfer Target
. FAB : FOUP, FOSB and Reticle
. Backend : Cassette, Magazine and Tray
- Velocity
. Straight / Curve : 3.3 / 1.0㎧
. Acceleration / Deceleration : 2.5㎨ / 3.5㎨
- Branch/Join Method : Vehicle self switching
- Power Supply : CPS-Contact less Power Supply (duplexing)
- Transfer Interface
. Process Equipment, Stocker, Conveyor and Lifter
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.