Overview

Line automation system for transferring various wafer packages with high cleanliness and high speed

Feature

- Transferring wafer packages with optimal path between manufacturing processes/equipments by OCS(OHT Control System)
- Transfer Target
  . FAB : FOUP, FOSB and Reticle
  . Backend : Cassette, Magazine and Tray
- Velocity
  . Straight / Curve : 3.3 / 1.0㎧
  . Acceleration / Deceleration : 2.5㎨ / 3.5㎨
- Branch/Join Method : Vehicle self switching
- Power Supply : CPS-Contact less Power Supply (duplexing)
- Transfer Interface
. Process Equipment, Stocker, Conveyor and Lifter