IRIS 12B is the 300mm single wafer processing equipment that can process front side and back side etching, stripping, bevel treatment, cleaning, rinsing and drying.
Dual stack chamber
- Implemented a 2 story structure design to reduce footprint and improved chemical recycling to reduce overall CoO
High throughput 370WPH
- SEMES’ high speed transfer robot system and wafer handling scheduler increased production speed up to 370WPH
RAMs for CoO (Reliability Availability Maintainability for Cost of Ownership)
- Multi processing chamber unit with 2 chemical nozzles plus 3 optional nozzles adds versatility
- Consisted with sonic, aerosol, backside, bevel etching, IPA and optional nozzles for <45nm process.