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System Engineering Mega Solution

System Engineering Mega Solution

MICHELAN C3

Model

Series

Semiconductor Equipment


Transaction Process

Please contact the manufacturer/supplier.

Payment

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Delivery

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Shipment

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Origin

Korea (Republic of)


Description

Overview

ICP Type Plasma Etcher for WLP, SOH, DPT Etching Process 


Feature

Process Performance

- Specialized Critical Etch Process
   : DRAM, Flash, 3D NAND and Logic Applications
- Fast Etch / Various Control Knobs for Uniform Etch Rate
- High Mask Selectivity / High Accuracy of CD Control
- Low Particle / Verticle Etching

Productivity / Hardware
- Cluster Transfer Module : Max. 6 Chambers
- Quadra Type Transfer Module : Max. 6 Chambers (All for Processing)
- ICP Type Etcher : High Plasma Density
- RF Sync Pulse Function : High Aspect Ratio
- Multi-Zone ESC Heating and 3Z-Tunale : Gas Radial Uniformity Control
- Low C.o.O / Long MTBC
- High Throughput

Inquiry

KOMACHINE CO., LTD.
CEO  Charlie ParkCorporate #  553-86-00664
(Post 17015) 1101ho ,16-4, Dongbaekjungang-ro 16beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, Republic of Korea

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