Overview

ICP Type Plasma Etcher for WLP, SOH, DPT Etching Process 

Feature

Process Performance

- Specialized Critical Etch Process
   : DRAM, Flash, 3D NAND and Logic Applications
- Fast Etch / Various Control Knobs for Uniform Etch Rate
- High Mask Selectivity / High Accuracy of CD Control
- Low Particle / Verticle Etching

Productivity / Hardware
- Cluster Transfer Module : Max. 6 Chambers
- Quadra Type Transfer Module : Max. 6 Chambers (All for Processing)
- ICP Type Etcher : High Plasma Density
- RF Sync Pulse Function : High Aspect Ratio
- Multi-Zone ESC Heating and 3Z-Tunale : Gas Radial Uniformity Control
- Low C.o.O / Long MTBC
- High Throughput