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System Engineering Mega Solution

System Engineering Mega Solution

MICHELAN O2

Model

Series

Semiconductor Equipment


Transaction Process

Please contact the manufacturer/supplier.

Payment

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Delivery

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Shipment

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Origin

Korea (Republic of)


Description

Overview

CCP Type Plasma Etcher for HARC Etching and Via/Dama Etching Process 


Feature

Process performance

- Specialized Critical Etch Process
  : DRAM, Flash, 3D NAND and Logic Applications
- Low Particle / Verticle Etching
- High Etch Rate / High Mask Selectivity 
- Precise CD and CD Uniformity Control
- Low Micro-loading Effect

Productivity / Hardware

- Cluster Transfer Module : Max. 6 Chambers
- RF Sync Pulse Function : High Aspect Ratio
- Radial Uniformity Control HW : Gas and Temperature
- Low C.o.O / Long MTBC
- High Throughput

Inquiry

KOMACHINE CO., LTD.
CEO  Charlie ParkCorporate #  553-86-00664
(Post 17015) 1101ho ,16-4, Dongbaekjungang-ro 16beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, Republic of Korea

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