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System Engineering Mega Solution

System Engineering Mega Solution

System Engineering Mega Solution

System Engineering Mega Solution

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System Engineering Mega Solution

System Engineering Mega Solution

SW9000

Model

Series

Semiconductor Equipment


Transaction Process

Please contact the manufacturer/supplier.

Payment

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Delivery

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Shipment

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Origin

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Description

Overview

This machine is for cutting and sorting molded leadframes/PCBs.  


Feature

- Application PKG : FBGA, CSP, MCP, Flip Chip and QFN
- High Throughput and Stability (30,000 UPH) 
- Free Too Kit Conversion (50% Save Cost and Time)
- Large Strip Size (300mm x 120mm)
- Enhanced Cleaning System (PVA and Bubble Jet)

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.