System Engineering Mega Solution
System Engineering Mega Solution
1/1
Description
Overview
This machine is to detect a condition of chips by contacting the pad inside of the chips with tiny needles.
Feature
- Contact Accuracy: ±1um (Advanced motion control technology)
- Improved loading accuracy (Wafer change & align time reduction)
- Applied stiffed Z axis (420Kgf)
- Applied auto leveling & secured contact stability (10㎛)
- User friendly (SACC ; Side semi Auto Card Change function)
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.