This machine is to detect a condition of chips by contacting the pad inside of the chips with tiny needles.
- Contact Accuracy: ±1um (Advanced motion control technology)
- Improved loading accuracy (Wafer change & align time reduction)
- Applied stiffed Z axis (420Kgf)
- Applied auto leveling & secured contact stability (10㎛)
- User friendly (SACC ; Side semi Auto Card Change function)