Overview

This machine is to test device and IC module by connecting automatically with external test equipment. 

Feature

Direct Hot & Cold Temp Test

- Each Socket Active Thermal Control(High Accuracy)
- Temperature Stabilization Time within 10minutes
- Optimized Direct Cold Temperature Testing(-25℃ Continuous for 30days)

Excellent Test Efficiency Increase

- Loading/Unloading Time Minimize
- Direct Loading/Unloading System (No Buffer)
- Jam Rate < 1/150,000 (High Accuracy Pick & Place Head 100㎛↓)
- Unfilled C-Tray Quick Recognize by 3D Inspection Vision(Loading Time Minimize)
- Unload BIN Sorting Time Minimize by Four Head
- High Speed & High Accuracy Pick & Place System