Overview

This machine is to attach chips on leadframes/PCBs at high speed.

Feature

Thin die handling without any die crack

- Using specialized patent air ejector
- Handling 25↑㎛ die thickness

High productivity and excellent accuracy

- 2-step bonding for thin & large size die
- Placement accuracy : ±15㎛@3σ (with under vision)
- 4M vision installation (substrate, under vision)
- High accurate dispenser unit