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System Engineering Mega Solution

System Engineering Mega Solution

SEMBOND

Model

Series

Semiconductor Equipment


Transaction Process

Please contact the manufacturer/supplier.

Payment

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Delivery

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Shipment

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Origin

Korea (Republic of)


Description

Overview

This machine is to attach chips on leadframes/PCBs at high speed.

 

Feature

Thin die handling without any die crack

- Using specialized patent air ejector
- Handling 25↑㎛ die thickness

High productivity and excellent accuracy

- 2-step bonding for thin & large size die
- Placement accuracy : ±15㎛@3σ (with under vision)
- 4M vision installation (substrate, under vision)
- High accurate dispenser unit

Inquiry

KOMACHINE CO., LTD.
CEO  Charlie ParkCorporate #  553-86-00664
(Post 17015) 1101ho ,16-4, Dongbaekjungang-ro 16beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, Republic of Korea

ⓒ2022 Komachine Co. All rights reserved.