Overview

This machine is to attach chips on leadframes/PCBs at high speed.

Feature

High Productivity and Excellent Accuracy

- Placement Accuracy : ±6㎛ @ SRM - UPEH : Max 7,000
- High Performance Vision Installation (Substrate/ Die / Wafer/ Under vision)
- Inspection : Crack / Particle / Align miss
- MCP Stack Package ( 16 Chip Stack ↑)
- Thin Die Handling System : Thin Die 25 ㎛ & Eject Time : 0.3Sec

Various Handling Capability
- Wafer Bin Grade Work Capability & Heterogeneous Package Product / Two Rail
- Full Auto Device Change & Material Automation System
- Wafer/ MGZ/ Heterogeneous PCB & Mixed Handling System