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System Engineering Mega Solution

System Engineering Mega Solution

System Engineering Mega Solution

System Engineering Mega Solution

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System Engineering Mega Solution

System Engineering Mega Solution

SDB-3000MD Plus

Model

Series

Semiconductor Equipment


Transaction Process

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Payment

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Delivery

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Shipment

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Origin

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Description

Overview

This machine is to attach chips on leadframes/PCBs at high speed.

 

Feature

High Productivity and Excellent Accuracy

- Placement Accuracy : ±6㎛ @ SRM - UPEH : Max 7,000
- High Performance Vision Installation (Substrate/ Die / Wafer/ Under vision)
- Inspection : Crack / Particle / Align miss
- MCP Stack Package ( 16 Chip Stack ↑)
- Thin Die Handling System : Thin Die 25 ㎛ & Eject Time : 0.3Sec

Various Handling Capability
- Wafer Bin Grade Work Capability & Heterogeneous Package Product / Two Rail
- Full Auto Device Change & Material Automation System
- Wafer/ MGZ/ Heterogeneous PCB & Mixed Handling System

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.