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System Engineering Mega Solution

System Engineering Mega Solution

SDB-3000MD Plus

Model

Series

Semiconductor Equipment


Transaction Process

Please contact the manufacturer/supplier.

Payment

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Delivery

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Shipment

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Origin

Korea (Republic of)


Description

Overview

This machine is to attach chips on leadframes/PCBs at high speed.

 

Feature

High Productivity and Excellent Accuracy

- Placement Accuracy : ±6㎛ @ SRM - UPEH : Max 7,000
- High Performance Vision Installation (Substrate/ Die / Wafer/ Under vision)
- Inspection : Crack / Particle / Align miss
- MCP Stack Package ( 16 Chip Stack ↑)
- Thin Die Handling System : Thin Die 25 ㎛ & Eject Time : 0.3Sec

Various Handling Capability
- Wafer Bin Grade Work Capability & Heterogeneous Package Product / Two Rail
- Full Auto Device Change & Material Automation System
- Wafer/ MGZ/ Heterogeneous PCB & Mixed Handling System

Inquiry

KOMACHINE CO., LTD.
CEO  Charlie ParkCorporate #  553-86-00664
(Post 17015) 1101ho ,16-4, Dongbaekjungang-ro 16beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, Republic of Korea

ⓒ2022 Komachine Co. All rights reserved.