Overview

This machine is to detect a condition of chips by contacting the pad inside of the chips with tiny needles. 

Feature

- Applicable Wafer Size: 8inch ~ 12inch
- Applied precise linear motor
- Realization of control for contact accuracy (±1um)
- Improved loading accuracy (Wafer change & align time reduction)
- Realization of high speed index
- Applied high pin force and stiffed Z axis (250Kgf)
- Applied auto leveling & secured contact stability (10㎛)
- User friendly (IP Net, network function)