SPECIFICATIONS

EQUIP. DIMENSION

1160(L)mm×840(W)mm×1690(H)mm

WEIGHT

500Kg

IC CHIP SIZE

4~23mm(L), 1.0~5mm(W)

GLASS SIZE

1.0” ~ 7.0”

PATTERN PITCH

38 ㎛ (25㎛ 2열 배열시)

BONDING ACCURACY

±5 ~ 6 ㎛

TACKTIME(1 IC BONDING)

9~12sec

AILGNMENT

Vision System (Auto Alignment)

BONDING HEAD 수량

2 Head

UTILITY

MAIN POWER:220V±10%, 2.0KW, 50/60Hz

AIR : 5~6 Kg/cm2, 250L/min, Ø8 Hose