| Item |
Description |
| Chamber |
1 process chamber, 1 load lock chamber with standard wafer
magazines, Compact & Automatic load/lock system |
| Arm transfer |
Robot arm transfer module |
| Process module |
Planar type high density plasma source, Electrostatic wafer clamping
with He backside cooling |
| RF System |
Source 13.56MHz / 2.0 kW
Bias 13.56MHz / 600 W, Auto matching network |
| Vacuum control |
Auto pressure control with throttle valve |
| Gas channel |
Max. 6ch Gas delivery module with mass flow controller |
| Operation |
PC base control including Windows user interface for fully automatic
process control |
| Dimension |
1,550(W) x 1,255(D) x 2,090(H) mm |
| Weight |
Approx. 120 kg (8 inch type) |
