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Semi COG Bonder (24")
Model Name
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Series
Large Machine
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Yujin Discom

LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment

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Manufacturer
Yujin Discom
Product Type
Machine
Brand
-
SKU
32873
Product Name
Semi COG Bonder (24")
Model Name
-
Size
-
Weight
-
Product Details

본 설비는 LCD GLASS 위에 IC Chip을 부착하는 설비이다. IC Chip은 Robot에 의해 Tray에서 자동 공급되며 LCD GLASS Loading Unloading을 수동으로 하면 Alignment에서 IC Chip Bonding까지 자동으로 작업한다. 

 

SPECIFICATIONS

EQUIP. DIMENSION

1160(L)mm×840(W)mm×1690(H)mm

WEIGHT

500Kg

IC CHIP SIZE

4~23mm(L), 1.0~5mm(W)

GLASS SIZE

1.0” ~ 7.0”

PATTERN PITCH

38 ㎛ (25㎛ 2열 배열시)

BONDING ACCURACY

±5 ~ 6 ㎛

TACKTIME(1 IC BONDING)

9~12sec

AILGNMENT

Vision System (Auto Alignment)

BONDING HEAD 수량

2 Head

UTILITY

MAIN POWER:220V±10%, 2.0KW, 50/60Hz

AIR : 5~6 Kg/cm2, 250L/min, Ø8 Hose
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Yujin Discom
Yujin Discom
LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
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