This machine is to bond the ACF attached panel with manually aligned FPC film by heat and pressure. Turn type and 2 head/ 4 stage type.
1. 4 turning stage and 2 bonding head installed.
2. Pressure and temperature is maintained evenly.
3. Use the micro speed cylinder to control the pressure precisely.
4. Compact machine size.
5. Zoom type CCD camera applied for various FPC
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SPECIFICATIONS
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EQUIP. DIMENSION
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1100(W)mm×670(L)mm×1830(H)mm
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WEIGHT
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550Kg
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PANEL SIZE
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1.5 ~ 3.5 inch
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PANEL THICKNESS
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(0.3x~1.1)x2mm
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PATTERN PITCH
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80㎛(Max)
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BONDING TEMP.
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RT~300℃(Controller)
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BONDING ACCURACY
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±12~15㎛
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TACT TIME
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10~12sec(Bonding time 13sec)
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BONDING PRESSURE
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2.5~80kgf
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ALIGNMENT
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X, Y, Θmanual stage
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PRESSURE METHOD
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Micro Speed Cylinder (Ø50*20st) & Precise Regulator
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UTILITY
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MAIN POWER: 1Phase, 220V, 4.0KW, 50/60Hz
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AIR : 5~6 Kg/cm2, 300L/min, Ø10 Hose
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