LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
This machine is to bond the ACF attached panel with FPC film after align, with heat and pressure. (Turn type, 1 head / 2 turn stage)
SPECIFICATIONS
EQUIP. DIMENSION
920(L)mm×650(W)mm×1770(H)mm
WEIGHT
220Kg
PANEL SIZE
16~75(W), 15~61(L) <3.5”max>
PANEL THICKNESS
(0.3~1.1)*2mm
1 FPC BONDING TIME (S/T)
20sec (bonding time 15sec 시)
FPC THICKNESS
0.1~0.2mm
PATTERN PITCH
0.1mm(max)
BONDING ACCURACY
±12~15 ㎛
EMPERATURE
Room Temperature ~ 350℃(controller 상)
UTILITY
MAIN POWER:220V±10%,1.2KW, 50/60Hz
AIR : 5~6 Kg/cm2, 240L/min, Ø10 Hose