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Semi COG Bonder (2Head)
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Yujin Discom

LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment

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Manufacturer
Yujin Discom
Product Type
Machine
Brand
-
SKU
32853
Product Name
Semi COG Bonder (2Head)
Model Name
-
Size
-
Weight
-
Product Details

This machine is to bond the IC chip on the LCD glass. IC chip supplied automatically from the tray by robot arm. LCD glass loading is manual, alignment and IC chip bonding is automatic. (ACF bonding process should be done with ACF bonding machine.)

 

SPECIFICATIONS

EQUIP. DIMENSION

1160(L)mm×840(W)mm×1690(H)mm

WEIGHT

500Kg

IC CHIP SIZE

4~23mm(L), 1.0~5mm(W)

GLASS SIZE

1.0” ~ 7.0”

PATTERN PITCH

38 ㎛ (25㎛ 2 line )

BONDING ACCURACY

±5 ~ 6 ㎛

TACKTIME(1 IC BONDING)

9~12sec

AILGNMENT

Vision System (Auto Alignment)

BONDING HEAD

2 Head

UTILITY

MAIN POWER:220V±10%, 2.0KW, 50/60Hz

AIR : 5~6 Kg/cm2, 250L/min, Ø8 Hose
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Yujin Discom
Yujin Discom
LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
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