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ACF Bonder
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Yujin Discom

LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment

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Manufacturer
Yujin Discom
Product Type
Machine
Brand
-
SKU
32852
Product Name
ACF Bonder
Model Name
-
Size
-
Weight
-
Product Details

This machine is to attach the ACF which is the medium within panel and FPC, TAB and IC CHIP, on the panel.
 

SPECIFICATIONS

EQUIP. DIMENSION

700(L)mm×635(W)mm×1640(H)mm

WEIGHT

150Kg

GLASS SIZE

16~75(W)mm, 15~61(L)mm <3.5”max>

ACF FEEDING LENGTH

4~75mm(L), 1~5mm(W)

TACT TIME

5~8sec

BONDING ACCURACY

±0.3mm(L), ±0.1mm(W)

ACF FEEDING

Air Cylinder & Micrometer head

ACF PROTECTIVE FILM REMOVE

Vacuum

PRESSING TOOL

Air Cylinder

UTILITY

MAIN POWER:220V±10%,0.5KW, 50/60Hz

AIR : 5~6 Kg/cm2, 180L/min, Ø8 Hose
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Yujin Discom
Yujin Discom
LCD, OLED, PDP, VFD, Touch Panel Semi conductor equipment
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