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JINWOO ENGINEERING

JINWOO ENGINEERING

Wiring Thin Film Coater For TSP

Model

Series

Plasma Application


Transaction Process

Please contact the manufacturer/supplier.

Payment

Contact the manufacturer/supplier.

Delivery

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Shipment

Contact the manufacturer/supplier.

Origin

Korea (Republic of)


Description

Wiring Thin Film Coater For TSP

Equipment deposits Wiring Thin Film onto the parts’ surface by incorporating the Sputter & Thermal Heater method and is intended for Pattern Mo-Al-Mo & Phosphor-Bronze Plating of the G1F & G2 method implemented TSP used in Mobile Phones & Tablet PCs. 

JINWOO ENGINEERING Wiring Thin Film Coater For TSP

Features

1

High

User Friendly

1. Rotative & Orbital Load/Unloading
2. Magazine 12ea Load/Unloading

Production Capacity

1,080ea/1Hr, 4” based

2

Low

Temp

 

Operating Cost

 

Coefficient Of Friction

 

 

Specification

Works Space

L4500*D6500*H2700

Weight

4.5 Tons

Main

Chamber

Φ1,600*H1600

Source

Sputter+ Thermal Heater

Work Jig

Φ125 * 28 Axis

Pump

Diffusion Pump

20” 1 Set

Rotary & Booster Pump

gxs250 & EH2600

Vacuum Level

5*10-5torr

Option

Chiller

20RT

Poly Coldp

100,000L/Sec

 

Comparison

 

Wise-WTF 1600 (Batch Type)

In Line Type

Capa

Batch Time

60min

Long

Glass Size

4”

7”

10.1”

Optimized

1 Batch

1,080

320

192

Day [22Hr]

35,640

10,560

6,336

Month [26Day]

926,640

274,560

164,736

Deposition Temp

   

Target

Rotative & Orbital Magazine 12ea

Titanium Carrier

 

 

Inquiry

KOMACHINE CO., LTD.
CEO  Charlie ParkCorporate #  553-86-00664
(Post 17015) 1101ho ,16-4, Dongbaekjungang-ro 16beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, Republic of Korea

ⓒ2022 Komachine Co. All rights reserved.