Manufacturer of Automobile facility, Super precision welding facility, Measuring inspection facility, Electron gun production facility
Wiring Thin Film Coater For TSP
Equipment deposits Wiring Thin Film onto the parts’ surface by incorporating the Sputter & Thermal Heater method and is intended for Pattern Mo-Al-Mo & Phosphor-Bronze Plating of the G1F & G2 method implemented TSP used in Mobile Phones & Tablet PCs.
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Features |
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1 |
High |
User Friendly |
1. Rotative & Orbital Load/Unloading |
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Production Capacity |
1,080ea/1Hr, 4” based |
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2 |
Low |
Temp |
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Operating Cost |
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Coefficient Of Friction |
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Specification |
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Works Space |
L4500*D6500*H2700 |
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Weight |
4.5 Tons |
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Main |
Chamber |
Φ1,600*H1600 |
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Source |
Sputter+ Thermal Heater |
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Work Jig |
Φ125 * 28 Axis |
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Pump |
Diffusion Pump |
20” 1 Set |
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Rotary & Booster Pump |
gxs250 & EH2600 |
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Vacuum Level |
5*10-5torr |
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Option |
Chiller |
20RT |
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Poly Coldp |
100,000L/Sec |
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Comparison |
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Wise-WTF 1600 (Batch Type) |
In Line Type |
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Capa |
Batch Time |
60min |
Long |
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Glass Size |
4” |
7” |
10.1” |
Optimized |
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1 Batch |
1,080 |
320 |
192 |
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Day [22Hr] |
35,640 |
10,560 |
6,336 |
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Month [26Day] |
926,640 |
274,560 |
164,736 |
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Deposition Temp |
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Target |
Rotative & Orbital Magazine 12ea |
Titanium Carrier |
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