Chat with us, powered by LiveChat Residual Stress Tester | J&L Tech - Komachine
Product Name Residual Stress Tester
Model
Series The Film Measure Equipment
Catalog
Product Description

In case of thin film has compress stress of tensile stress, tester measures deforming rate of the board-thin film complex and calculates the residual stress.

 

Characteristics of RESIDUAL STRESS TESTER

• Automatic control of X-Y axis
• Compute residual stress by usage of thin film's curvature Stoney formula
• (Able to measure of amorphous state)
• Easy to control

 

Precautions

• Measuring test: Circuit board needs to use Si-wafer with 250 ± 15㎛ thickness, length better be 10 times compare to width.
• Thickness of thin film has to be slimmer than 1/50 size of circuit board.

 

Specification of RESIDUAL STRESS TESTER

Range of Curvature 2m ~ 100m
Range of Measurement 60Mpa ~ 10Gpa
Resolution of Measurement 10Mpa
Range of Measurement error < 10%
Length of Maximum Scan 30mm
Stap of Minimum Scan 0.2mm
Thickness of Wafer 100um ~ 800um
Thickness of Coati ng film 0.05um ~ 10um
Scan Stage Stroke 30mm
Scan Stage Resolution 25um
Loading Stage Stroke 140mm
Loading stage Resolution 0.5mm
Speed of Measurement 0.02mm/s
Size of Test Piece 40mm[length] x 4mm[width]
Specification of PSD Sensor 5um
Device Size 500[W] x 500[D] x 500[H] mm
Weight 30kg
Power consumption 150W

Products of J&L Tech