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J&L Tech

Residual Stress Tester

Model

Series

The Film Measure Equipment


Transaction Process

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Payment

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Delivery

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Shipment

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Origin

Korea (Republic of)


Description

In case of thin film has compress stress of tensile stress, tester measures deforming rate of the board-thin film complex and calculates the residual stress.

 

Characteristics of RESIDUAL STRESS TESTER

• Automatic control of X-Y axis
• Compute residual stress by usage of thin film's curvature Stoney formula
• (Able to measure of amorphous state)
• Easy to control

 

Precautions

• Measuring test: Circuit board needs to use Si-wafer with 250 ± 15㎛ thickness, length better be 10 times compare to width.
• Thickness of thin film has to be slimmer than 1/50 size of circuit board.

 

Specification of RESIDUAL STRESS TESTER

Range of Curvature 2m ~ 100m
Range of Measurement 60Mpa ~ 10Gpa
Resolution of Measurement 10Mpa
Range of Measurement error < 10%
Length of Maximum Scan 30mm
Stap of Minimum Scan 0.2mm
Thickness of Wafer 100um ~ 800um
Thickness of Coati ng film 0.05um ~ 10um
Scan Stage Stroke 30mm
Scan Stage Resolution 25um
Loading Stage Stroke 140mm
Loading stage Resolution 0.5mm
Speed of Measurement 0.02mm/s
Size of Test Piece 40mm[length] x 4mm[width]
Specification of PSD Sensor 5um
Device Size 500[W] x 500[D] x 500[H] mm
Weight 30kg
Power consumption 150W

Inquiry

KOMACHINE CO., LTD.
CEO  Charlie ParkCorporate #  553-86-00664
(Post 17015) 1101ho ,16-4, Dongbaekjungang-ro 16beon-gil, Giheung-gu, Yongin-si, Gyeonggi-do, Republic of Korea

ⓒ2022 Komachine Co. All rights reserved.