설명 : 세계 최초로 기술 개발한 E-Beam Micro Joining System (Micro Welding)

특징

1) 고 분해능을 지닌 Sub-micron 크기의 부품 용접 및 Joining : Probe Current (~100uA for Macro Joining)
2) SEM과 Joining을 융합한 Hybrid 제품.
3) 고객 사양의 제품화 가능 — 기술 Consulting 지원
4) Chamber내에 Micro-manipulator장착 가능
5) 다양한 기능 탑재 가능 (확장성)
6) BSE detector를 통한 실시간 가공 처리의 동영상 관찰가능

제품사양

Gun Specification

Source Tungsten Hair-Pin Filament(LaB6/ Th coated Tungsten Filament 적용 Available)

Low Power & High Performance

Fast response system for preventing welding

High welding quality and welding repeatability,

Possibility of gun mounting on a robotic manipulator

Voltage power 35KeV (Max.40KeV)

Beam current max. 50uA(Guaranty사양) – (최대 Ip ≥ 100uA)
Inspection Resolution : Minimum 5nm

Seam Tracking with BSE detector – Cooling System prevent damage from thernal-electron

Application

E-beam Micro Joining with surface cleanness.

Quality welding of metal with high reflexibility Ag, Cu, etc.

Micro Metal Powder Melting ; Ti, Al, Cobalt-Chrome, Alloy powder, etc.

Fine and complicated structure SOS (System on Chip), Precision Valve.

Wetting/Joining for CPU Casing, Gas Sensor.

Precision parts welding for Aircraft, Automobile industry, Aerospace and Power Engineering.