Overview

Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition

to our product line, the CVD system. Chemical Vapor Deposition is a chemical reactive

process used to produce high-purity, high-performance solid materials in a vacuum state.

In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors

which react and / or decompose on the substrate surface to produce a desired deposit.

Plasma Enhanced Chemical Vapor Deposition (PECVD) is a unique form of the CVD

process used primarily to deposit thin films from a gaseous state (vapor) to a solid state

on some substrate. PECVD is not dependent upon thermal energy alone to create of

maintain a chemical reaction but rather it uses RF-enhanced glow discharge to convey

energy to a reactive gas which subsequently, in a vacuum environment, sets the

conditions necessary for effective thin film deposition.

Features

≻ Compared to other CVD application, PECVD allows for operations in a high-vacuum, low-temp environment

≻ Specially designed gas shower head provides uniform gas flow – consistent film thickness over a surface

≻ Can distribute multiple gases, independently about the substrate and mixed outside of gas shower head

≻ Semi – or Fully- Automate processing available

≻ Capable of multi-layer, co-deposition processing

≻ High deposition rates-fast!

Overview

Korea Vacuum Tech, Ltd. (KVT) is proud to introduce the latest revolutionary addition

to our product line, the CVD system. Chemical Vapor Deposition is a chemical reactive

process used to produce high-purity, high-performance solid materials in a vacuum state.

In a typical CVD process, the wafer (substrate) is exposed to one or more volatile precursors

which react and / or decompose on the substrate surface to produce a desired deposit.

Plasma Enhanced Chemical Vapor Deposition (PECVD) is a unique form of the CVD

process used primarily to deposit thin films from a gaseous state (vapor) to a solid state

on some substrate. PECVD is not dependent upon thermal energy alone to create of

maintain a chemical reaction but rather it uses RF-enhanced glow discharge to convey

energy to a reactive gas which subsequently, in a vacuum environment, sets the

conditions necessary for effective thin film deposition.

Features

≻ Compared to other CVD application, PECVD allows for operations in a high-vacuum, low-temp environment

≻ Specially designed gas shower head provides uniform gas flow – consistent film thickness over a surface

≻ Can distribute multiple gases, independently about the substrate and mixed outside of gas shower head

≻ Semi – or Fully- Automate processing available

≻ Capable of multi-layer, co-deposition processing

≻ High deposition rates-fast!