Function & Features
- Automatic chemical-etching the multi-layer of die(wafer)
- The world’s first automation system.
- Easy control through convenient GUI
- Real-time inspection through enlarged images
- Repetitions made simple using recipe files
- Forced removal system for harmful gases
- Safety that needs no protective devices for workers
- All the processes necessary for deprocess realized in a unit of system (wet etching, cleaning, ultrasonic, inspection)
- Minimal maintenance cost and long lifecycles
Specification
| Item |
Description |
| Dimension |
2495(W) x 1050(D) x 1820(H) mm |
| Weight |
Approx. 650 kg |
| Procedure |
Chemical Etching, Heating, De-Ionized Water, N₂Cleaning
Ultrasonic Cleaning, Drying |
| Handling Wafer Size |
1x1 mm ~ 30x30 mm |
| Chemical Bath |
4 ea Bath (2 ea bath heating) |
| Heating Temperature |
Bath Heating Type (2 ea bath): (Room Temp.)~ 150 °C |
| Cleaning System |
Ultrasonic & De-Ionized Water |
| Dry System |
Air/N₂gas, Beam Heater |
| Utility |
Roted Voltage : AC 220V/110V, 1 Phase
Roted Current : 15A
Roted Frequency : 50 ~ 60 Hz
Air Pressure : 6kg/㎠ (bar)
Fume Exhaust Line
De-Ionized Water Supply / Drain |
| Program |
User Interface : Window Based Graphical User Interface |
