MIS
MIS
Description
Function & Features
- Automatic laser decapsulation system
- All types of semiconductor package can be removed
- Any material(Au, Cu, Al) of wire part and 2nd bonding area can be opened
- Effective decapsulation solution for Cu wire chip : Minimize the damage on Cu wire by chemical etching after laser operation
- A few hundred microns of EMC on die surface can be opened with chemical etching(by manual or MIS Wet Etch : Minimal acid use)
- Easy, simple, fast and safe operation
> Vision camera provides real time image
> User can set the decap area by mouse drag / numerical value input
> User can see laser decapsulation process & result on monitor screen
> Superimposing X-ray image on real-time sample picture is available
> Auto door lock : System door is not opened during laser operation
> Automatic Z axis adjustment by PC program
- User can observe the operation process through the window(protected from laser radiation)
- Repetitions made simple using recipe files
- Fume & Dust can be exhausted (Option: Fume & Dust collector)
Specification
| Item | Description |
| Laser | ND YVO4 1064nm |
| Guide Laser | 632nm Laser Class 2 (Red Beam) |
| Dimension | 840(W) x 705(D) x 1500(H) mm |
| Weight | Approx. 150 kg |
| Handling IC Size | 2x2 mm ~ 100x100 mm |
| Vision Camera | Color |
| Utility | Roted Voltage : AC 220V, 1 Phase Roted Current : 15A, Roted Frequency : 50 ~ 60 Hz |
| Program | User Interface : Window Based Graphical User Interface X-ray image data import available (Superimposition) |
| Option | Fume & Dust Collector |