MIS
MIS
Description
Function & Features
- Using End mill for the milling of EMC
- Fast, safe, and accurate milling work
- Prompt and accurate milling by robot motions (Average milling time < 1 min.)
- Robot motion (X, Y, Z axis) having the precision of minimum 0.01mm (10㎛)
- Automatically recognizing the height of the sample surface through a sensor and doing the milling work
- Providing various sizes of end mills (Φ1.0, Φ2.0, Φ3.0 mm)
- Very effective for the removal of metal surface
- Reducing the molding (EMC) thickness, which makes the decapsulation work finished fast
- Providing the guide well for etching zones
- Backside milling which is effective for removing PCB and molding
Specification
| Item | Description |
| Dimension | 430(W) x 575(D) x 620(H) mm |
| Weight | Approx. 80 kg |
| Procedure | Milling |
| Handling IC Size | 2x2 mm ~ 80x80 mm (Minimum Milling Depth : Approx. 0.01 mm) |
| Cleaning System | Vacuum Cleaner (Option) |
| Process Time | 1~2 min.(Average Time) |
| Utility | Roted Voltage : AC 220V/110V, 1 Phase Roted Current : 15A Roted Frequency : 50 ~ 60 Hz Air Pressure : 6kg/㎠ (bar) |
| Program | Microprocessor Control Panel |
Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664
ⓒ2024 Komachine Inc. All rights reserved.