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MIS Auto Decaper

Model

Series

Semiconductor Equipment


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Description

Function & Features 
 

  
- All the works necessary for decap are realized through Auto Decaper. 
- The automated robot decapsulation system that has been developed first in the world 
- The functions of milling, etching, heating, acetone cleaning,   drying, ultrasonic cleaning, and vision inspection available. 
- Protecting workers from harmful chemicals 
- Minimizing damage etching of copper in the case of copper wired IC 
- Minimizing the damage on the ball or the tape at the bottom of a package 
- Fast, safe, and efficient decapsulation 
- Protecting workers and equipment through the built-in exhaust system 
- The functions of checking decap results through enlarged clear images, saving images, and printing images available.
- Dual heating (MIS-specialized technology) 
- More precise, faster, and safer decap possible. 
- Easy control through convenient GUI 
- Repetitions made simple using recipe files 
- Consumable gaskets are unnecessary and very small amount of etching chemical is used. 
- Expanded decap possibility for various sizes and patterns of packages 
- Minimal maintenance and repair costs, and long lifecycles

 

Decapped IC Samples

MIS MIS Auto Decaper MD-2006A

 

Specification

Item Description
Dimension 1420(W) x 875(D) x 1720(H) mm
Weight Approx. 250 kg
Procedure Milling, Etching, Heating, Cleaning, Ultrasonic Cleaning, Inspection
Handling IC Size 2x2 mm ~ 50x50 mm
(Minimum Milling Depth : Approx. 0.01 mm)
Etchant Fuming Nitric Acid, Sulfuric Acid, Fuming Sulfuric Acid
Cleaning Solution Acetone
Heating Temperature 1. Beam Heater : (Room Temp.)~ 400 °C
2. Jig Heater : (Room Temp.)~ 250 °C
Free Control by Dual Heating System
Ultrasonic 38~40 KHz
Process Time Milling: 1~2 min., Etching~Cleaning: 3~15 min. (Average Time)
Utility Roted Voltage : AC 220V/110V, 1 Phase
Roted Current : 15A
Roted Frequency : 50 ~ 60 Hz
Air Pressure : 6kg/㎠ (bar)
Fume Exhaust Line
De-Ionized Water Supply / Drain
Program User Interface : Window Based Graphical User Interface
Applications BGA, PBGA, BOC, DIP, QFP, CSP, SCSP, MCM, TSOP and etc.

Inquiry

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.