Function & Features
- All the works necessary for decap are realized through Auto Decaper.
- The automated robot decapsulation system that has been developed first in the world
- The functions of milling, etching, heating, acetone cleaning, drying, ultrasonic cleaning, and vision inspection available.
- Protecting workers from harmful chemicals
- Minimizing damage etching of copper in the case of copper wired IC
- Minimizing the damage on the ball or the tape at the bottom of a package
- Fast, safe, and efficient decapsulation
- Protecting workers and equipment through the built-in exhaust system
- The functions of checking decap results through enlarged clear images, saving images, and printing images available.
- Dual heating (MIS-specialized technology)
- More precise, faster, and safer decap possible.
- Easy control through convenient GUI
- Repetitions made simple using recipe files
- Consumable gaskets are unnecessary and very small amount of etching chemical is used.
- Expanded decap possibility for various sizes and patterns of packages
- Minimal maintenance and repair costs, and long lifecycles
Decapped IC Samples

Specification
| Item |
Description |
| Dimension |
1420(W) x 875(D) x 1720(H) mm |
| Weight |
Approx. 250 kg |
| Procedure |
Milling, Etching, Heating, Cleaning, Ultrasonic Cleaning, Inspection |
| Handling IC Size |
2x2 mm ~ 50x50 mm
(Minimum Milling Depth : Approx. 0.01 mm) |
| Etchant |
Fuming Nitric Acid, Sulfuric Acid, Fuming Sulfuric Acid |
| Cleaning Solution |
Acetone |
| Heating Temperature |
1. Beam Heater : (Room Temp.)~ 400 °C
2. Jig Heater : (Room Temp.)~ 250 °C
Free Control by Dual Heating System |
| Ultrasonic |
38~40 KHz |
| Process Time |
Milling: 1~2 min., Etching~Cleaning: 3~15 min. (Average Time) |
| Utility |
Roted Voltage : AC 220V/110V, 1 Phase
Roted Current : 15A
Roted Frequency : 50 ~ 60 Hz
Air Pressure : 6kg/㎠ (bar)
Fume Exhaust Line
De-Ionized Water Supply / Drain |
| Program |
User Interface : Window Based Graphical User Interface |
| Applications |
BGA, PBGA, BOC, DIP, QFP, CSP, SCSP, MCM, TSOP and etc. |