MIS
MIS
Description
Function & Features
- Automatic chemical decapsulation equipment
- The functions of etching, heating, acetone cleaning, and drying available
- Protecting workers from harmful chemicals
- Minimizing damage etching of copper in the case of copper wired IC
- Minimizing the damage on the ball or the tape at the bottom of a package
- Fast, safe, and efficient decapsulation
- Dual heating (MIS-specialized technology)
- More precise, faster, and safer decap possible.
- Repetitions made simple using recipe files
- Consumable gaskets are unnecessary and very small amount of etching chemical is used.
- Expanded decap possibility for various sizes and patterns of packages
- Minimal maintenance and repair costs, and long lifecycles
- LED Chip Package Decap available
Specification
| Item | Description |
| Dimension | 740(W) x 600(D) x 1650(H) mm |
| Weight | Approx. 180 kg |
| Procedure | Etching, Heating, Cleaning |
| Handling IC Size | 2x2 mm ~ 50x50 mm |
| Etchant | Fuming Nitric Acid, Sulfuric Acid, Fuming Sulfuric Acid |
| Cleaning Solution | Acetone |
| Heating Temperature | 1. Beam Heater : (Room Temp.)~ 400 °C 2. Jig Heater : (Room Temp.)~ 250 °C Free Control by Dual Heating System |
| Process Time | Etching~Cleaning: 3~15 min. (Average Time) |
| Utility | Roted Voltage : AC 220V/110V, 1 Phase Roted Current : 15A Roted Frequency : 50 ~ 60 Hz Air Pressure : 6kg/㎠ (bar) Fume Exhaust Line De-Ionized Water Supply / Drain |
| Program | Microprocessor Control Panel |