MIS, The Republic of Korea - Komachine Supplier Profile and Product List

- A company specializing in the development and production of automated decapping equipment and precision etching systems for removing surface molding from semiconductors and electronic components. Provision of diverse etching and process equipment solutions, including the MIS Auto Decaper, the world's first automated robotic decapping system. Possession of advanced technology in high-precision semiconductor manufacturing process equipment, encompassing laser decapping, wet etching, and mill etching. Capabilities in developing equipment for optimizing semiconductor and display processes, such as Track Systems and slurry reduction nozzle devices.A company specializing in the development and production of automated decapping equipment and precision etching systems for removing surface molding from semiconductors and electronic components. Provision of diverse etching and process equipment solutions, including the MIS Auto Decaper, the world's first automated robotic decapping system. Possession of advanced technology in high-precision semiconductor manufacturing process equipment, encompassing laser decapping, wet etching, and mill etching. Capabilities in developing equipment for optimizing semiconductor and display processes, such as Track Systems and slurry reduction nozzle devices.
- **MIS Auto Decaper (Model: MD-2006A)**: The world's first automated robotic equipment for safely and effectively removing surface molding (EMC, Epoxy Molding Compounds) from packaged semiconductors and electronic parts. Integration of milling, etching, heating, acetone cleaning, drying, ultrasonic cleaning, and vision inspection functions, with dual heating technology and repeatability through recipe files. Handling of ICs ranging from 5x5mm to 50x50mm, with a minimum milling depth precision of 0.01mm.**MIS Auto Decaper (Model: MD-2006A)**: The world's first automated robotic equipment for safely and effectively removing surface molding (EMC, Epoxy Molding Compounds) from packaged semiconductors and electronic parts. Integration of milling, etching, heating, acetone cleaning, drying, ultrasonic cleaning, and vision inspection functions, with dual heating technology and repeatability through recipe files. Handling of ICs ranging from 5x5mm to 50x50mm, with a minimum milling depth precision of 0.01mm.
- **MIS Wet Etch (Model: DW-07)**: An automated chemical decapping system performing etching, heating, acetone cleaning, and drying functions. Protection of workers from harmful chemicals, minimization of copper damage in Copper Wired ICs, and reduction of damage to balls or tapes on the package bottom. Processing of ICs from 2x2mm to 50x50mm, with compatibility for various etchants like fuming nitric acid and sulfuric acid.**MIS Wet Etch (Model: DW-07)**: An automated chemical decapping system performing etching, heating, acetone cleaning, and drying functions. Protection of workers from harmful chemicals, minimization of copper damage in Copper Wired ICs, and reduction of damage to balls or tapes on the package bottom. Processing of ICs from 2x2mm to 50x50mm, with compatibility for various etchants like fuming nitric acid and sulfuric acid.
- **MIS Mill Etch (Model: DM-07)**: Equipment for milling EMC using an End Mill, enabling fast, safe, and accurate milling operations. Robot-driven milling functions with an average processing time of less than 1 minute, and X, Y, Z-axis robot motion precision of at least 0.01mm (10㎛). Handling of ICs from 2x2mm to 80x80mm, effective for metal surface removal and backside milling.**MIS Mill Etch (Model: DM-07)**: Equipment for milling EMC using an End Mill, enabling fast, safe, and accurate milling operations. Robot-driven milling functions with an average processing time of less than 1 minute, and X, Y, Z-axis robot motion precision of at least 0.01mm (10㎛). Handling of ICs from 2x2mm to 80x80mm, effective for metal surface removal and backside milling.
- **Laser Decaper (Model: ML-2000)**: A laser-based semiconductor IC decapping system capable of removing all types of semiconductor packages (EMC). Minimization of Cu wire damage, and precise decapping area designation through real-time vision camera and X-ray image superimposition. Wide range of applicability, handling ICs from 2x2mm to 100x100mm.**Laser Decaper (Model: ML-2000)**: A laser-based semiconductor IC decapping system capable of removing all types of semiconductor packages (EMC). Minimization of Cu wire damage, and precise decapping area designation through real-time vision camera and X-ray image superimposition. Wide range of applicability, handling ICs from 2x2mm to 100x100mm.
- **MIS Deprocessor (Model: MP-2007A)**: An etching system capable of decapping micro-semiconductors, partial etching of silicon chips, and selective delaminating of multi-layered chips with micrometer-level precision.**MIS Deprocessor (Model: MP-2007A)**: An etching system capable of decapping micro-semiconductors, partial etching of silicon chips, and selective delaminating of multi-layered chips with micrometer-level precision.
- **Plasma Etching System (Model: MPI-6000, 8000)**: A plasma-based etching system, addressing diverse requirements in semiconductor processes.**Plasma Etching System (Model: MPI-6000, 8000)**: A plasma-based etching system, addressing diverse requirements in semiconductor processes.
- **Track System (Model: MLT-6000)**: A track system for 2, 4, and 6-inch wafers, including 2C2D / 2C3D LED track systems and wafer balance & alignment technology. Provision of refurbishment services to convert older 6, 8-inch tracks to 2, 4-inch LED tracks.**Track System (Model: MLT-6000)**: A track system for 2, 4, and 6-inch wafers, including 2C2D / 2C3D LED track systems and wafer balance & alignment technology. Provision of refurbishment services to convert older 6, 8-inch tracks to 2, 4-inch LED tracks.
- **Slurry Reduction Nozzle Device**: Technology aimed at optimizing slurry usage in semiconductor processes, leading to cost reduction and efficiency improvement.**Slurry Reduction Nozzle Device**: Technology aimed at optimizing slurry usage in semiconductor processes, leading to cost reduction and efficiency improvement.
- **World's First Automated Robotic Decap Technology**: The MIS Auto Decaper, the world's first automated robotic equipment for safely and effectively removing surface molding from packaged semiconductors and electronic components, offering a unique solution replacing manual work and multiple existing machines.**World's First Automated Robotic Decap Technology**: The MIS Auto Decaper, the world's first automated robotic equipment for safely and effectively removing surface molding from packaged semiconductors and electronic components, offering a unique solution replacing manual work and multiple existing machines.
- **High-Precision Etching and Decap Process Implementation**: Capability for precise processing of micro-semiconductors and complex chips through robot motion control technology with a minimum precision of 0.01mm (10㎛) and Deprocessor technology enabling micrometer-level delaminating operations.**High-Precision Etching and Decap Process Implementation**: Capability for precise processing of micro-semiconductors and complex chips through robot motion control technology with a minimum precision of 0.01mm (10㎛) and Deprocessor technology enabling micrometer-level delaminating operations.
- **Diverse Decap and Etching Method Portfolio**: Possession of various decapping and etching equipment, including laser, wet chemical, and milling methods, providing customized solutions tailored to diverse customer needs and material characteristics.**Diverse Decap and Etching Method Portfolio**: Possession of various decapping and etching equipment, including laser, wet chemical, and milling methods, providing customized solutions tailored to diverse customer needs and material characteristics.
- **Maximized Process Efficiency and Safety**: Automated systems minimizing worker exposure to harmful chemicals, ensuring workplace safety through built-in exhaust systems and safety interlock functions. Furthermore, elimination of consumable gaskets and minimal use of etching chemicals for reduced maintenance costs and enhanced production efficiency.**Maximized Process Efficiency and Safety**: Automated systems minimizing worker exposure to harmful chemicals, ensuring workplace safety through built-in exhaust systems and safety interlock functions. Furthermore, elimination of consumable gaskets and minimal use of etching chemicals for reduced maintenance costs and enhanced production efficiency.
- **Customer-Tailored Solutions and Technological Collaboration**: A track record of developing and supplying the MIS Auto-Deprocessor as a strategic project for Samsung Electronics. Pursuit of R&D through joint technology licensing agreements with the Korea Institute of Science and Technology (KIST).**Customer-Tailored Solutions and Technological Collaboration**: A track record of developing and supplying the MIS Auto-Deprocessor as a strategic project for Samsung Electronics. Pursuit of R&D through joint technology licensing agreements with the Korea Institute of Science and Technology (KIST).
- **Continuous Research and Development and Technological Innovation**: Ongoing efforts in developing innovative products in nano-processing equipment and display fields, with a management philosophy prioritizing customer satisfaction based on creative technology and trust leading the global market.**Continuous Research and Development and Technological Innovation**: Ongoing efforts in developing innovative products in nano-processing equipment and display fields, with a management philosophy prioritizing customer satisfaction based on creative technology and trust leading the global market.
- Semiconductor Manufacturing IndustrySemiconductor Manufacturing Industry
- Electronic Component Manufacturing IndustryElectronic Component Manufacturing Industry
- Display Manufacturing Industry (LCD, LED)Display Manufacturing Industry (LCD, LED)
- Mobile Device Manufacturing IndustryMobile Device Manufacturing Industry
- Award of the 'Gyeonggi Small and Medium Business Technology Award' in 2007 (CEO Shin Kyung-wook).Award of the 'Gyeonggi Small and Medium Business Technology Award' in 2007 (CEO Shin Kyung-wook).
- Establishment of joint technology licensing agreements and pursuit of R&D with the Korea Institute of Science and Technology (KIST).Establishment of joint technology licensing agreements and pursuit of R&D with the Korea Institute of Science and Technology (KIST).
- Securing capital investment from the Korea Development Bank, recognizing technological and business viability.Securing capital investment from the Korea Development Bank, recognizing technological and business viability.
- Development technology for the MIS Auto Decaper as the world's first automated robotic equipment.Development technology for the MIS Auto Decaper as the world's first automated robotic equipment.
- Development technology for the MIS Deprocessor as the world's first etching equipment capable of micro-semiconductor decapping, partial etching, and delaminating (micrometer-level precision).Development technology for the MIS Deprocessor as the world's first etching equipment capable of micro-semiconductor decapping, partial etching, and delaminating (micrometer-level precision).
- Precision and fast decapping process technology through Dual Heating (MIS specialized technology).Precision and fast decapping process technology through Dual Heating (MIS specialized technology).
- Acquisition of Wafer balance & align technique and Track System protocol (MLT-6000).Acquisition of Wafer balance & align technique and Track System protocol (MLT-6000).
- Accumulation of LED factory automation technology, defect analysis, and production item equipment technology.Accumulation of LED factory automation technology, defect analysis, and production item equipment technology.