MIS, The Republic of Korea - Komachine Supplier Profile and Product List

- MIS Semiconductor is a company specializing in the development and production of automated decapping and precision etching equipment for semiconductors and electronic components. It offers various etching and process equipment solutions, including the MIS Auto Decaper, recognized as the world's first automated robotic decapping system. The company possesses advanced technological capabilities in laser decapping, wet etching, and mill etching for high-precision semiconductor manufacturing processes. Its focus lies in enhancing process efficiency and reducing production costs within the semiconductor manufacturing industry.MIS Semiconductor is a company specializing in the development and production of automated decapping and precision etching equipment for semiconductors and electronic components. It offers various etching and process equipment solutions, including the MIS Auto Decaper, recognized as the world's first automated robotic decapping system. The company possesses advanced technological capabilities in laser decapping, wet etching, and mill etching for high-precision semiconductor manufacturing processes. Its focus lies in enhancing process efficiency and reducing production costs within the semiconductor manufacturing industry.
- MIS Auto Decaper (MD-2006A): The world's first automated robotic equipment designed for safe and effective removal of surface molding (EMC, Epoxy Molding compounds) from packaged semiconductors and electronic components. It integrates milling, etching, heating, acetone cleaning, drying, ultrasonic cleaning, and Vision inspection functions, offering dual heating and repeatable processes via recipe files.MIS Auto Decaper (MD-2006A): The world's first automated robotic equipment designed for safe and effective removal of surface molding (EMC, Epoxy Molding compounds) from packaged semiconductors and electronic components. It integrates milling, etching, heating, acetone cleaning, drying, ultrasonic cleaning, and Vision inspection functions, offering dual heating and repeatable processes via recipe files.
- Laser Decaper (ML-2000): A semiconductor IC decapping equipment utilizing laser technology, capable of removing all types of semiconductor packages (EMC). It minimizes damage to Cu wires and supports die surface opening, providing real-time video through a vision camera and allowing decapping area designation by superimposing X-ray images.Laser Decaper (ML-2000): A semiconductor IC decapping equipment utilizing laser technology, capable of removing all types of semiconductor packages (EMC). It minimizes damage to Cu wires and supports die surface opening, providing real-time video through a vision camera and allowing decapping area designation by superimposing X-ray images.
- MIS Deprocessor (MP-2007A): The world's first etching equipment capable of decapping ultra-small semiconductors, partial etching of silicon chips, and selective layer removal (delaminating) of multi-layered chips. This auto wet station equipment offers micrometer-level precision.MIS Deprocessor (MP-2007A): The world's first etching equipment capable of decapping ultra-small semiconductors, partial etching of silicon chips, and selective layer removal (delaminating) of multi-layered chips. This auto wet station equipment offers micrometer-level precision.
- Plasma Etching System (MPI-6000, 8000): A plasma-based etching system featuring one process chamber and one load lock chamber. It includes a robot arm transfer module, a planar high-density plasma source, an RF system (Source 13.56MHz / 2.0 kW, Bias 13.56MHz / 600 W), and automatic pressure control.Plasma Etching System (MPI-6000, 8000): A plasma-based etching system featuring one process chamber and one load lock chamber. It includes a robot arm transfer module, a planar high-density plasma source, an RF system (Source 13.56MHz / 2.0 kW, Bias 13.56MHz / 600 W), and automatic pressure control.
- Track System (MLT-6000): A track system designed for 2, 4, and 6-inch wafers, incorporating 2C2D / 2C3D LED track systems and wafer balancing and alignment technology.Track System (MLT-6000): A track system designed for 2, 4, and 6-inch wafers, incorporating 2C2D / 2C3D LED track systems and wafer balancing and alignment technology.
- MIS Wet Etch (DW-07): Equipment for wet etching processes of semiconductors and electronic components.MIS Wet Etch (DW-07): Equipment for wet etching processes of semiconductors and electronic components.
- MIS Mill Etch (DM-07): Equipment for mill etching processes of semiconductors and electronic components.MIS Mill Etch (DM-07): Equipment for mill etching processes of semiconductors and electronic components.
- Slurry Reduction Nozzle: A device designed to improve efficiency in semiconductor and display processes by reducing slurry consumption.Slurry Reduction Nozzle: A device designed to improve efficiency in semiconductor and display processes by reducing slurry consumption.
- Vacuum Valve: A critical component used to control vacuum conditions in semiconductor manufacturing processes.Vacuum Valve: A critical component used to control vacuum conditions in semiconductor manufacturing processes.
- Development and commercialization of the world's first automated robotic decapping equipment, the MIS Auto Decaper. This provides an innovative solution that improves the risks and inefficiencies of traditional manual methods.Development and commercialization of the world's first automated robotic decapping equipment, the MIS Auto Decaper. This provides an innovative solution that improves the risks and inefficiencies of traditional manual methods.
- Technological capability in automated robotic equipment contributing to enhanced work safety, improved operational efficiency, and reduced production costs. Its design minimizes exposure to harmful sulfuric and nitric acid fumes and reduces acid consumption by more than five times.Technological capability in automated robotic equipment contributing to enhanced work safety, improved operational efficiency, and reduced production costs. Its design minimizes exposure to harmful sulfuric and nitric acid fumes and reduces acid consumption by more than five times.
- Possession of high-precision etching and process equipment technologies, including laser, wet, and mill etching. Capability to perform micrometer-level precision tasks such as ultra-small semiconductor decapping, partial silicon chip etching, and selective layer removal of multi-layered chips.Possession of high-precision etching and process equipment technologies, including laser, wet, and mill etching. Capability to perform micrometer-level precision tasks such as ultra-small semiconductor decapping, partial silicon chip etching, and selective layer removal of multi-layered chips.
- Expertise in developing Track Systems and Slurry Reduction Nozzle devices for optimizing semiconductor and display processes. Continuous R&D efforts aimed at developing innovative products with top performance in nano-processing and display fields.Expertise in developing Track Systems and Slurry Reduction Nozzle devices for optimizing semiconductor and display processes. Continuous R&D efforts aimed at developing innovative products with top performance in nano-processing and display fields.
- A strong foundation in technological investment, supported by excellent manufacturing capabilities and numerous patent applications. A corporate culture dedicated to continuous R&D for world-class technology, products, services, and quality.A strong foundation in technological investment, supported by excellent manufacturing capabilities and numerous patent applications. A corporate culture dedicated to continuous R&D for world-class technology, products, services, and quality.
- PC-controlled automated robotic systems ensuring fast and accurate process execution. Features like real-time monitoring via vision cameras and decapping area designation by superimposing X-ray images enhance user convenience and precision.PC-controlled automated robotic systems ensuring fast and accurate process execution. Features like real-time monitoring via vision cameras and decapping area designation by superimposing X-ray images enhance user convenience and precision.
- Semiconductor Manufacturing Industry: Surface molding removal and precision etching processes after semiconductor packaging.Semiconductor Manufacturing Industry: Surface molding removal and precision etching processes after semiconductor packaging.
- Electronic Components Manufacturing Industry: Decapping and etching operations for various electronic components.Electronic Components Manufacturing Industry: Decapping and etching operations for various electronic components.
- Display Manufacturing Industry (LCD, LED): Optimization of display panel manufacturing processes and supply of related equipment.Display Manufacturing Industry (LCD, LED): Optimization of display panel manufacturing processes and supply of related equipment.
- Mobile Device Manufacturing Industry: Processes for ultra-small semiconductors and electronic components used in mobile devices.Mobile Device Manufacturing Industry: Processes for ultra-small semiconductors and electronic components used in mobile devices.
- South Korea, Taiwan (patent acquired)South Korea, Taiwan (patent acquired)
- United States (patent pending)United States (patent pending)
- Acquisition of domestic patents related to the MIS Auto Decaper.Acquisition of domestic patents related to the MIS Auto Decaper.
- Acquisition of patents in Taiwan.Acquisition of patents in Taiwan.
- Patent applications pending in the United States and Japan.Patent applications pending in the United States and Japan.
- Joint technology implementation agreement signed with Korea Institute of Science and Technology in December 2005.Joint technology implementation agreement signed with Korea Institute of Science and Technology in December 2005.
- Possession of a Corporate R&D Center certification.Possession of a Corporate R&D Center certification.
- Possession of an Innovative Small and Medium Business certification.Possession of an Innovative Small and Medium Business certification.
- Possession of a Materials, Parts, and Equipment Specialist Company certification.Possession of a Materials, Parts, and Equipment Specialist Company certification.
- Securing unique technological capabilities through numerous patent applications.Securing unique technological capabilities through numerous patent applications.