The Hawk™ is a dry cleaning system for memory and logic device which provides a perfectly clean Si surface for deep contact plug integration and all of the Epi processes including Si, SiGe and III-V materials. 

Key Features

- Single Wafer Dry Cleaning Process with Gas Chemicals

- Eugene's Own Dual Rotated Spiral ICP Antenna Plasma Source

- High Radical Density

- Plasma Damage Free

- Wide Range of Process Parameters

Benefits

- Controllable Map, Concave or Convex

- Excellent Uniformity

- Good Coverage at Deep Contact

- High Throughput

Applications