The BlueJay™ : Temperature uniformity control and tunable process gas flow in our multi-chamber, single wafer platform offer unique process flexibility, excellent film thickness uniformity and repeatability, lower thermal budgets and ease of tool matching.

The BlueJay-e™ : Next generation, compact version offering the same process advantages with a smaller footprint and lower CoO

Key Features

- Independent Dual Zone Temperature Control for Better Film Uniformity

- Up to 800°C Process Capability 

- High Throughput 

- Optimized Design Based on the Computational Flow Dynamics (CFD)

- Flexible Gas Panel Configuration

- Centralized Architecture Using Device Net Protocol

Benefits

- Excellent Thickness Uniformity & Reproducibility

- Lower Thermal Budget vs. Traditional Batch Furnaces

- Lower Particle Generation via In-situ Dry Cleaning

- Multiple Applications with Versatile Gas Options

- Industry Standard Tool with Production-proven Platform

Applications