The Phoenix™: Unique chamber design, with laminar flow capability and excellent plasma uniformity enables deposition of high quality films for challenging applications. Plasma Enhanced ALD system provides the superior film quality using Eugene Technology’s patented Super Cycle Densification Technology.

Key Features

- Deposition Temperature Range: 50~550°C

- Patented Plasma Densification Process

- Compact Twin Chamber Configuration with Laminar Flow

- Square Type Chamber, CCP Design

- Wafer Rotation for Various Thickness Map ; Flat, Convex, Concave

Benefits

- High Throughput: Four (4), Twin Chamber Process Modules
- Excellent Step Coverage and Minimized Loading Effect
- Excellent Thickness Uniformity and Repeatability 
- Wet Etch Rate Control
- High Density Film Quality at Low Temperature
- Good Electrical Characteristics and Low Wet Etch Properties

Applications