Description

SFA SEMICON offers the Thin Small Outline Package (TSOP). Reliability and thin profile are keys for TSOP attributes using surface mount technology (SMT). TSOP is available in a thermally enhanced version (TSOP-ep), as well as a stacked die version (TSOP-SD). Die stacking is available from 2 to 4 die, with bonding pads on two sides of the die or single-sided bonding pads. SFA SEMICON uses the latest leadframe technology and state of the art design and simulation tools to achieve optimum electrical and thermal performance. SFA SEMICON’s state of the art assembly facility and proven materials assure high yield manufacturing and long term reliability.

Application

ㆍMemory, SRAM, DRAM, Flash

ㆍRF / Wireless

ㆍLogic and Linear

ㆍPortable electronics

ㆍNetworking equipment

Feature

ㆍJEDEC Standard compliance

ㆍType 1 / Type 2

ㆍDie stack (DDP / QDP) Applicable

ㆍGreen materials (Pb-free / RoHS compliance)

ㆍLead pitch ≥ 0.50mm