기업 등록
반도체, LED, PCB, 레이저 마킹 시스템 등
▪ 2D inspection with good resolution
▪ 3D height measurement of the attached components
▪ Multiple handling of various types of packaging - JEDEC tray, SUS tray, strip, etc.
▪ IR optics for inspection through silicon
* Optional stage heating
▪ IR Inspection
▪ BLT Measurement