Wafer Macro Inspection 

▪ High throughput with dual lens system

▪ Chip inspection after sawing

▪ Kerf inspection

▪ Advanced D2D algorithm using golden die extracted from neighboring 4 dies

▪ Verifying review module included

▪ Self-developed lens for wide field of view and good resolution

▪ Real time auto focusing module adopted

▪ Optional IR inspection to inspect defects, cracks and chippings inside silicon.