FO-WLP : Fan Out Wafer Level Package

CoC, CoW : Chip on Chip, Chip on Wafer

FCCSP : Flip Chip Chip Scale Package

FCBGA : Flip Chip Ball Grid Array

FBGA : Fine-pitch Ball Grid Array

FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die

SIP : System in Package

PBGA : Plastic Ball Grid Array

QFN : Quad Flat No Leads

TSOP : Thin Small Outline Package

SOP : Small Outline Package

QFP : Quad Flat Package

DIP : Dual In-line Package

Micro SD Card : Micro Secure Digital Card

SD Card : Secure Digital Card