product Image
product Image
QFN : Quad Flat No Leads
Model Name
-
Series
Lead Frame
View All
Data
QFN : Quad Flat No Leads
Manufacturer information
provider logo
SFA Semicon

Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing

Problem with product info?
Update request
Manufacturer
SFA Semicon
Product Type
Machine
Brand
-
SKU
35735
Product Name
QFN : Quad Flat No Leads
Model Name
-
Size
-
Weight
-
Product Details
More products
FO-WLP : Fan Out Wafer Level Package
FO-WLP : Fan Out Wafer Level Package
TO-220
QFP : Quad Flat Package
QFP : Quad Flat Package
SD Card : Secure Digital Card
SD Card : Secure Digital Card
Micro SD Card : Micro Secure Digital Card
Micro SD Card : Micro Secure Digital Card
DIP : Dual In-line Package
DIP : Dual In-line Package
SOP : Small Outline Package
SOP : Small Outline Package
TSOP : Thin Small Outline Package
TSOP : Thin Small Outline Package
SIP : System in Package
SIP : System in Package
PBGA : Plastic Ball Grid Array
PBGA : Plastic Ball Grid Array
FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die
FBGA Stack Die : Fine-pitch Ball Grid Array Stack Die
FBGA : Fine-pitch Ball Grid Array
FBGA : Fine-pitch Ball Grid Array
FCCSP : Flip Chip Chip Scale Package
FCCSP : Flip Chip Chip Scale Package
FCBGA : Flip Chip Ball Grid Array
FCBGA : Flip Chip Ball Grid Array
CoC, CoW : Chip on Chip, Chip on Wafer
CoC, CoW : Chip on Chip, Chip on Wafer
SFA Semicon
SFA Semicon
Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
Inquiry