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DIP : Dual In-line Package
Model Name
-
Series
Lead Frame
Data
DIP : Dual In‐line Package
Manufacturer information
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SFA Semicon

Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing

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Manufacturer
SFA Semicon
Product Type
Machine
Brand
-
SKU
35739
Product Name
DIP : Dual In-line Package
Model Name
-
Size
-
Weight
-
Product Details

Description

SFA SEMICON is committed to continuing to service this long established standard industry package. The SFA SEMICON's DIP comes in a wide range of lead counts: from 7 - 24 leads with a lead pitch of 100 mils.

 

Application

ㆍLogic, memory, microcontrollers, video controllers

ㆍConsumer electronics, commercial electronics, automotive

ㆍTelecommunications

 

Feature

ㆍJEDEC Standard compliance

ㆍGreen materials (Pb-free / RoHS compliance)

ㆍLead pitch ≥ 1.78mm

SFA Semicon
SFA Semicon
Assembly and Test, Bumping, Packaging semi conductor manufacturing, Assembly, Inspection, Toll processing, Image analysis transport manufacturing
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