기업 등록
반도체장비 제조 전문업체, 자동화장비, 공압, 트레이피더, 실린더 등
ㆍHigh Speed and Accuracy Flip-Chip Bonding system ㆍLinear Bond head with touch down control ㆍFull bump Inspection and post Inspection capability ㆍMCM(multi-chip module) capability(Dual Wafer) ㆍWafer Mapping and SECS/GEM