BGA Saw & Sort Vision System is a PC-based standalone vision system that performs different types of vision inspection routines after being attached in-line to the M/Cs in the saw and sort processes, wherein the frames of CSP (chip scale package) materials are sliced into IC packages and arranged in trays. This consists of inlet vision that performs directional inspection for correct insertion of material before sawing, ball vision which inspects existence, quality, position and package size of ball attached to each package product after sawing, and mark vision that automatically determines abnormality of marking state.