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OverviewProduct ListModel # List

Series5

Semiconductor Packaging Equipment

Semiconductor Test & Final Process Equipment

Semiconductor EMI Shielding Equipment

Camera Module Automation Equipment

Tool & Others

Product List

33

Auto Ball Placement System

BPS-8200

Finer Pitch Solder Ball Placement System

BPS-7200HD

Auto Solder Ball Placement System for Flip Chip

BPS-7200FC

Auto Ball Placement System

BPS-6200FC

Strip Marking System

SMS-5000

Lead To Lead Attach System

LTL-5000

Strip & Cover Plate Off Loading System with Vision System

ASU-5000

Strip & Cover Plate Loading System with Laser Marking

ASL-5000

Automatic Substrate Loading System

APP-7000L

Package Sorter System

PSS-7000

High Speed Pick & Place System (Boat to Tray Loader)

APP-7200UR

Automatic Pick & Place System (Boat to Tray Loader)

APP-7000UR

Auto Flux Pre-Cleaning System

FPS-8000V

Auto Stiffener Attach System

ASA-7200V

Flux Pre-Cleaning System (Stencil + Pin Transfer)

FPS-8100V

Flux Pre-Cleaning System (Cu OSP + TMV Package)

FPS-7200V

Automatic Tube to Tray Pick & Place System

TTS-3000MH

Automatic P&P for Tube to Tray or Tray to Tube

TTS-3000

Automatic Lead Condition System

LCS-5000

Semiconductor Package Test Handler System

THS-3200D

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SSP

SSP

Komachine Inc.
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
606, Seoul Stratup Center, 10,
Noryangjin-ro, Dongjak-gu, Seoul, South Korea 06938
CEOCharlie Park
Corporate #535-86-00664

ⓒ2024 Komachine Inc. All rights reserved.