product Image
Auto Ball Placement System
Model Name
BPS-6200FC
Series
Semiconductor Packaging Equipment
Data
-
Manufacturer information
provider logo
SSP

Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more

Problem with product info?
Update request
Manufacturer
SSP
Product Type
Machine
Brand
-
SKU
36037
Product Name
Auto Ball Placement System
Model Name
BPS-6200FC
Size
-
Weight
-
Product Details

SSP Auto Ball Placement System BPS-6200FC

Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more
Greetings, I would like to extend warm welcome and gratitude for visiting SSP, a semiconductor equipment manufacturer, growing to be the global leader in the field. Since our establishment in 1996, we have been growing together with customers as a company specialized in manufacturing of semiconductor equipment through active investment on talent fostering and technology innovation based on our management philosophy “Realizing Technology for Making Imagination into Reality” We foster technical experts with expertise and creativity. Acknowledged for our innovative design and technological innovation, we aim to become the global leader in the field.
Inquiry