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Finer Pitch Solder Ball Placement System
Model Name
BPS-7200HD
Series
Semiconductor Packaging Equipment
Data
-
Manufacturer information
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SSP

Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more

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Manufacturer
SSP
Product Type
Machine
Brand
-
SKU
36035
Product Name
Finer Pitch Solder Ball Placement System
Model Name
BPS-7200HD
Size
-
Weight
-
Product Details

SSP Finer Pitch Solder Ball Placement System BPS-7200HD

Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more
Greetings, I would like to extend warm welcome and gratitude for visiting SSP, a semiconductor equipment manufacturer, growing to be the global leader in the field. Since our establishment in 1996, we have been growing together with customers as a company specialized in manufacturing of semiconductor equipment through active investment on talent fostering and technology innovation based on our management philosophy “Realizing Technology for Making Imagination into Reality” We foster technical experts with expertise and creativity. Acknowledged for our innovative design and technological innovation, we aim to become the global leader in the field.
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