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Finer Pitch Solder Ball Placement System
Model Name
BPS-7200HD
Series
Semiconductor Packaging Equipment
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Data
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Manufacturer information
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SSP

Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more

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Manufacturer
SSP
Product Type
Machine
Brand
-
SKU
36035
Product Name
Finer Pitch Solder Ball Placement System
Model Name
BPS-7200HD
Size
-
Weight
-
Product Details

SSP Finer Pitch Solder Ball Placement System BPS-7200HD

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SSP
SSP
Semi conductor equipment manufacturer, SSP, BGA, Ball mount, Camera module equipment, Housing, Ball attach, Test handler, Automation equipment and more
Inquiry
Komachine Inc.
CEOCharlie Park
Corporate #535-86-00664
Head Office:
Ace Dongbaek Tower 1-1101, 16-4,
Dongbaekjungang-ro 16beon-gil, Giheung-gu,
Yongin City, Gyeonggido, South Korea 17015
Branch Office:
112, Garage L145, B1,
Saenggakgongjang, 150, Yeongdeungpo-ro, Yeongdeungpo-gu, Seoul, Republic of Korea 07292
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