Chat with us, powered by LiveChat Ion Milling Series | Korea Vacuum Tech - Komachine
Product Name
Model Ion Milling Series
Series Etcher
Catalog
Product Description

Overview

Ion-Beam etching is a versatile process for pattern delineation and material modification.

The low pressure, line-of-sight nature of beam techniques provides a flexibility of

directional bombardment not available in other plasma processes. The ability to etch

virtually any material by the sputtering process opens a wide variety of diverse

applications.

 

Features

≻ High selectivity, uniform plasma

≻ Simple configuration makes maintenance easy

≻ The physical and chemical etching systems are controlled independently

≻ Low damage & contamination

≻ Physical etching using Ar Ion-Beam distributes reactive gases such as Cl2, He, BCl3 evenly around substrate.

Specifications

ITEM

SPECIFICATIONS

System configuration

R&D

Substrate size

2” - 6” (50.8mm - 150mm)

Operating pressure (Torr)

> 1.0E-4 Torr

Uniformity within substrate /

substrate to substrate surfaces

± 5% max.

Ion source

3cm ~ 20scm (@1” ~ 8”)

Substrate

Tilt / Rotation / Cooling

Ultimate Pressure

1.0E-6Torr

Korea Vacuum Tech  Ion Milling Series

Products of Korea Vacuum Tech