Overview

Reactive ion Etching (RIE) is an etching technology that utilizes chemically reactive

plasma to remove masked materials deposited on wafers during microfabrication. The

combination of an electromagnetic field in a low pressure (vacuum) environment is

used to create a plasma source from which high energy ions attack a wafer surface and react.

Features

≻ High selectivity, uniform plasma etching

≻ Simple configuration makes maintenance easy

≻ Negative self-bias forms on lower electrode

≻ Low damage & contamination

Overview

Reactive ion Etching (RIE) is an etching technology that utilizes chemically reactive

plasma to remove masked materials deposited on wafers during microfabrication. The

combination of an electromagnetic field in a low pressure (vacuum) environment is

used to create a plasma source from which high energy ions attack a wafer surface and react.

Features

≻ High selectivity, uniform plasma etching

≻ Simple configuration makes maintenance easy

≻ Negative self-bias forms on lower electrode

≻ Low damage & contamination