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Product Name
Model RIE Series
Series Etcher
Catalog
Product Description

Korea Vacuum Tech  RIE Series

Overview

Reactive ion Etching (RIE) is an etching technology that utilizes chemically reactive

plasma to remove masked materials deposited on wafers during microfabrication. The

combination of an electromagnetic field in a low pressure (vacuum) environment is

used to create a plasma source from which high energy ions attack a wafer surface and react.

 

Features

≻ High selectivity, uniform plasma etching

≻ Simple configuration makes maintenance easy

≻ Negative self-bias forms on lower electrode

≻ Low damage & contamination

Specifications

ITEM

SPECIFICATIONS

System configuration

R&D

Substrate size

2” - 6” (50.8mm - 150mm)

Operating pressure (Torr)

< 30mTorr

Uniformity within substrate /

substrate to substrate surfaces

± 5% max.

Process Chamber

Al anodized Chamber

Substrate

Heating or cooling / Bias

Ultimate Pressure

1.0E-6Torr

Gas Nozzle

6” - 8” shower head type

Korea Vacuum Tech  RIE Series 1

Korea Vacuum Tech  RIE Series 2

Overview

Reactive ion Etching (RIE) is an etching technology that utilizes chemically reactive

plasma to remove masked materials deposited on wafers during microfabrication. The

combination of an electromagnetic field in a low pressure (vacuum) environment is

used to create a plasma source from which high energy ions attack a wafer surface and react.

Features

 

≻ High selectivity, uniform plasma etching

≻ Simple configuration makes maintenance easy

≻ Negative self-bias forms on lower electrode

≻ Low damage & contamination

Specifications

ITEM

SPECIFICATIONS

System configuration

R&D

Substrate size

2” - 6” (50.8mm - 150mm)

Operating pressure (Torr)

< 30mTorr

Uniformity within substrate /

substrate to substrate surfaces

± 5% max.

Process Chamber

Al anodized Chamber

Substrate

Heating or cooling / Bias

Ultimate Pressure

1.0E-6Torr

Gas Nozzle

6” - 8” shower head type

Korea Vacuum Tech  RIE Series 3

Products of Korea Vacuum Tech