Measurement

1. Thickness & Flatness           2. Bow & 15 points Warp

Wafer Inner Inspection

1. Micro Crack Detection           2. Inner Bubble & Defects Detection

Wafer Surface Inspection

1. Surface Crack Detection
2. Detection of the Foreign Material and the Contamination of the Wafer Surface
3. Edge Chipping Detection
4. Saw Mark Detection
5. Size Measurement
6. Squareness & Parallelization