Sungwoo Techron, established in 1997, is a company primarily engaged in the manufacturing of semiconductor inspection equipment and semiconductor components. A specialized enterprise in key backend semiconductor equipment, including test sockets and automated inspection systems. Possession of excellent technological capabilities through continuous challenging spirit and innovative technology development. A company aiming to provide the best technological services to its customers.SungwooTechron,establishedin1997,isacompanyprimarilyengagedinthemanufacturingofsemiconductorinspectionequipmentandsemiconductorcomponents.Aspecializedenterpriseinkeybackendsemiconductorequipment,includingtestsocketsandautomatedinspectionsystems.Possessionofexcellenttechnologicalcapabilitiesthroughcontinuouschallengingspiritandinnovativetechnologydevelopment.Acompanyaimingtoprovidethebesttechnologicalservicestoitscustomers.
Key Products/TechnologiesKeyProducts/Technologies
Capabilities in the development, design, and manufacturing of semiconductor manufacturing equipment and automated vision inspection (AVI) systems.Capabilitiesinthedevelopment,design,andmanufacturingofsemiconductormanufacturingequipmentandautomatedvisioninspection(AVI)systems.
Provision of inspection and manufacturing equipment solutions for various semiconductor and electronic components such as PCB, Lead Frame, COF, LENS, Wafer, and Battery.ProvisionofinspectionandmanufacturingequipmentsolutionsforvarioussemiconductorandelectroniccomponentssuchasPCB,LeadFrame,COF,LENS,Wafer,andBattery.
Advanced precision mechatronics technology and vision technology for the implementation of next-generation inspection equipment.Advancedprecisionmechatronicstechnologyandvisiontechnologyfortheimplementationofnext-generationinspectionequipment.
A product line of various automatic inspection and marking equipment, including BUMP FCCSP 2D AFVI M/C, BGA AFVI M/C (csp, boc, sip, utc, nsop), INK MARKING M/C, and LASER MARKING M/C.Aproductlineofvariousautomaticinspectionandmarkingequipment,includingBUMPFCCSP2DAFVIM/C,BGAAFVIM/C(csp,boc,sip,utc,nsop),INKMARKINGM/C,andLASERMARKINGM/C.
Precision inspection systems such as Wafer Chip Auto Vision Inspection Machine, High Resolution Auto Final Vision Inspection for PCB, Reel To Reel Auto Editing for COF Film, and 8K/9K/12K/13K/16K/18K LineScan Auto Vision Inspection Machine.PrecisioninspectionsystemssuchasWaferChipAutoVisionInspectionMachine,HighResolutionAutoFinalVisionInspectionforPCB,ReelToReelAutoEditingforCOFFilm,and8K/9K/12K/13K/16K/18KLineScanAutoVisionInspectionMachine.
Component business for lead frame post-processing and final inspection.Componentbusinessforleadframepost-processingandfinalinspection.
Manufacturing technology for key semiconductor components like LOC (Lead on Chip), IC (Integrated Circuit), FFC (Flexible Flat Cable), and internal wiring cables for electronic products.ManufacturingtechnologyforkeysemiconductorcomponentslikeLOC(LeadonChip),IC(IntegratedCircuit),FFC(FlexibleFlatCable),andinternalwiringcablesforelectronicproducts.
Inspection technology for Mobile/IT core package substrates and next-generation high-speed semiconductor substrates.InspectiontechnologyforMobile/ITcorepackagesubstratesandnext-generationhigh-speedsemiconductorsubstrates.
AI solution business expansion through AI algorithm-based inspection equipment performance improvement and collaboration with COGNEX.AIsolutionbusinessexpansionthroughAIalgorithm-basedinspectionequipmentperformanceimprovementandcollaborationwithCOGNEX.
Core AdvantagesCoreAdvantages
Extensive experience and know-how accumulated over 20 years in the IT & Digital field's automation systems.Extensiveexperienceandknow-howaccumulatedover20yearsintheIT&Digitalfield'sautomationsystems.
Ability to implement next-generation inspection algorithm optimization technology through R&D for ultra-lightweight, ultra-fine product inspection algorithms.Abilitytoimplementnext-generationinspectionalgorithmoptimizationtechnologythroughR&Dforultra-lightweight,ultra-fineproductinspectionalgorithms.
Capability to maximize quality reliability by analyzing and inspecting high-density PCB circuits with proprietary equipment.Capabilitytomaximizequalityreliabilitybyanalyzingandinspectinghigh-densityPCBcircuitswithproprietaryequipment.
Leading domestic production and pioneering overseas markets based on superior technology in semiconductor inspection equipment, lead frame manufacturing/inspection equipment, and PCB inspection equipment.Leadingdomesticproductionandpioneeringoverseasmarketsbasedonsuperiortechnologyinsemiconductorinspectionequipment,leadframemanufacturing/inspectionequipment,andPCBinspectionequipment.
Continuous R&D capability to expand and advance precision mechatronics technology and vision technology.ContinuousR&Dcapabilitytoexpandandadvanceprecisionmechatronicstechnologyandvisiontechnology.
Comprehensive production process management system from lead frame processing to inspection and packaging, all conducted in a cleanroom environment.Comprehensiveproductionprocessmanagementsystemfromleadframeprocessingtoinspectionandpackaging,allconductedinacleanroomenvironment.
Strengthening market competitiveness through expanding global clientele and increasing the proportion of high-value-added special equipment.Strengtheningmarketcompetitivenessthroughexpandingglobalclienteleandincreasingtheproportionofhigh-value-addedspecialequipment.
Securing technological competitiveness through continuous R&D investment and patent applications each year.SecuringtechnologicalcompetitivenessthroughcontinuousR&Dinvestmentandpatentapplicationseachyear.
Target IndustrieTargetIndustrie
Semiconductor Industry: Manufacturing and supply of semiconductor inspection equipment, backend process facilities, and core components.SemiconductorIndustry:Manufacturingandsupplyofsemiconductorinspectionequipment,backendprocessfacilities,andcorecomponents.
Automotive Industry: Supply of automotive inspection equipment, electrical/smart car inspection equipment, and electrical components such as FFC (Flexible Flat Cable).AutomotiveIndustry:Supplyofautomotiveinspectionequipment,electrical/smartcarinspectionequipment,andelectricalcomponentssuchasFFC(FlexibleFlatCable).
LED Industry: Application of LED test equipment and Premold LED substrate inspection algorithm development.LEDIndustry:ApplicationofLEDtestequipmentandPremoldLEDsubstrateinspectionalgorithmdevelopment.
Mobile/IT Industry: Inspection of Mobile/IT core package substrates and provision of related equipment solutions.Mobile/ITIndustry:InspectionofMobile/ITcorepackagesubstratesandprovisionofrelatedequipmentsolutions.
Battery Industry: Application of technology in battery manufacturing equipment and inspection equipment sectors.BatteryIndustry:Applicationoftechnologyinbatterymanufacturingequipmentandinspectionequipmentsectors.
Major MarketsMajorMarkets
China, Vietnam, JapanChina,Vietnam,Japan
USAUSA
Certifications/PatentsCertifications/Patents
Patent for Apparatus and Method for Inspecting Flatness of Ball Grid Array Package (2005.02.15).PatentforApparatusandMethodforInspectingFlatnessofBallGridArrayPackage(2005.02.15).
Patent for Bump Inspection Apparatus and Method (2010.12.23).PatentforBumpInspectionApparatusandMethod(2010.12.23).
Patent for Double-sided Flexible Flat Cable Manufacturing Apparatus (2010.07.11).PatentforDouble-sidedFlexibleFlatCableManufacturingApparatus(2010.07.11).
Patent for Tape Carrier Package Automatic Editing Apparatus and its Operation Method (2012.01.18).PatentforTapeCarrierPackageAutomaticEditingApparatusanditsOperationMethod(2012.01.18).
Patent for Flexible Flat Cable Manufacturing Apparatus for Vehicles (2013.11.13).PatentforFlexibleFlatCableManufacturingApparatusforVehicles(2013.11.13).
Patent for Optical Inspection Apparatus (2017.02.28).PatentforOpticalInspectionApparatus(2017.02.28).
Patent for Lead Frame Constant Speed Inspection Apparatus (2019.10.25).PatentforLeadFrameConstantSpeedInspectionApparatus(2019.10.25).
Patent for Cleaning System for Communication Module Printed Circuit Board (2020.09.28).PatentforCleaningSystemforCommunicationModulePrintedCircuitBoard(2020.09.28).
Acquisition of F-MARK(JQA) C-UL certification (UL).AcquisitionofF-MARK(JQA)C-ULcertification(UL).
Acquisition of C-UL certification (UL).AcquisitionofC-ULcertification(UL).
Awarded the 'Five Million Dollar Export Tower' in 2018.Awardedthe'FiveMillionDollarExportTower'in2018.
Introduction
Location
55 Changwon-daero 1144beon-gil, Seongsan-gu, Changwon-si, Gyeongsangnam-do, South Korea
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Information
55 Changwon-daero 1144beon-gil, Seongsan-gu, Changwon-si, Gyeongsangnam-do, South Korea